Thermal Stresses in Adhesively Bonded Joints: Numerical and Analytical Analysis
نویسندگان
چکیده
منابع مشابه
Analytical Solution of Stress Field in Adhesively Bonded Composite Single-Lap Joints Under Mechanical Loadings
In this paper, considering an adhesively bonded composite single-lap joint, a novel approach is presented to predict the peel and shear stress distributions of the adhesive layer for an ASTM standard test sample. In current method, the equilibrium equations are derived using the energy method and based on the Timoshenko’s beam theory. Two solution procedures then are discussed, one of which rep...
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Simulations using the Finite Element Method (FEM) play an increasingly important role in the design process of joints and fasteners in the aerospace industry. In order to utilize the potential of such adhesive bonding, there is an increasing need for effective and accurate computational methods. The geometry and the nature of an adhesive joint are, however, not so simple to describe effectively...
متن کاملFatigue life and backface strain predictions in adhesively bonded joints
Fatigue life and backface strain predictions in adhesively bonded joints. A. Graner Solana, A.D. Crocombe* and I.A. Ashcroft a Faculty of Engineering and Physical Sciences (J5), University of Surrey, Guildford, Surrey GU2 7XH, UK. b Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Leicestershire LE11 3TU, UK * Corresponding author. Tel: +44 1483 689194 Fax: +...
متن کاملExperimental and Analytical Investigations of the Dynamic Response of Adhesively Bonded Single Lap Joints
Dynamic response of single lap joints, subjected to a harmonic peeling load is studied theoretically and experimentally. In the theoretical part, dynamic response of a single lap joint clamped at one end and subjected to a harmonic peeling load at the other end is investigated. Adherents are modeled as Euler-Bernouli beams joined in the lap area by a viscoelastic adhesive layer. Both axial and ...
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ژورنال
عنوان ژورنال: Engineering Science & Technology
سال: 2021
ISSN: 2717-5243,2717-5235
DOI: 10.37256/est.212021729